发明名称 Semiconductor device, RF-IC and manufacturing method of the same
摘要 Provided is a technology capable of reducing parasitic capacitance of a capacitor while reducing the space occupied by the capacitor. A stacked structure is obtained by forming, over a capacitor composed of a lower electrode, a capacitor insulating film and an intermediate electrode, another capacitor composed of the intermediate electrode, another capacitor insulating film and an upper electrode. Since the intermediate electrode has a step difference, each of the distance between the intermediate electrode and lower electrode and the distance between the intermediate electrode and upper electrode in a region other than the capacitor formation region becomes greater than that in the capacitor formation region. For example, the lower electrode is brought into direct contact with the capacitor insulating film in the capacitor formation region, while the lower electrode is not brought into direct contact with the capacitor insulating film in the region other than the capacitor formation region.
申请公布号 US2006289917(A1) 申请公布日期 2006.12.28
申请号 US20060473229 申请日期 2006.06.23
申请人 FUJIWARA TSUYOSHI;IMAI TOSHINORI;SAIKAWA TAKESHI;KAWASAKI YOSHIHIRO;TOYA MITSUHIRO;MORI SHUNJI;OKABE YOSHIYUKI 发明人 FUJIWARA TSUYOSHI;IMAI TOSHINORI;SAIKAWA TAKESHI;KAWASAKI YOSHIHIRO;TOYA MITSUHIRO;MORI SHUNJI;OKABE YOSHIYUKI
分类号 H01L29/94 主分类号 H01L29/94
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