发明名称 Element fabrication substrate
摘要 A substrate used for fabricating devices thereon includes an insulating film, and a monocrystal Ge thin layer formed on the insulating film in contact therewith, the monocrystal Ge thin layer having a thickness not more than 6 nm. The monocrystal Ge thin layer has a thickness not less than 2 nm and a compressive strain.
申请公布号 US2006292835(A1) 申请公布日期 2006.12.28
申请号 US20060510745 申请日期 2006.08.28
申请人 KABUSHIKI KAISHI TOSHIBA 发明人 NAKAHARAI SHU;TEZUKA TSUTOMU;TAKAGI SHINICHI
分类号 H01L21/20;H01L29/161;C30B3/00;C30B29/08;H01L21/205;H01L21/28;H01L21/324;H01L21/336;H01L21/762;H01L21/84;H01L27/12;H01L29/10;H01L29/78;H01L29/786 主分类号 H01L21/20
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