| 摘要 |
A method for fabricating a semiconductor device is provided to avoid a peel-off phenomenon or scratching defects that differs in more than one layer on a substrate because of residual particles by eliminating the particles attached to the back surface of the substrate before a thin film is polished. A thin film is formed on the upper surface of a substrate, made of a conductive material used as electrically interconnection wires. The back surface of the substrate is polished by using a polishing solution containing resin particles on which functional groups exist(S122). The thin film formed on the upper surface of the substrate is polished.
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