摘要 |
A connecting assembly and an apparatus for depositing an atomic layer using the same are provided to substantially eliminate a dead zone by using a gasket, thereby effectively suppressing adhesion of particles onto an inner wall of pipeline. A connecting assembly includes a fastening member enclosing a circumference of pipeline(131,132) which provides a flow path of a fluid, to keep ends of the pipeline closely, and a gasket(150) interposed between ends of the pipeline for suppressing damage of the ends. A center portion of the gasket protrudes to come into contact with the flow path. An inner diameter of the pipeline is enlarged at a portion adjacent to the end, and the gasket has a funnel shape to come in contact with the enlarged portion.
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申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, SUNG HO;AHN, BYUNG HO;KIM, DAE OK;KIM, KI SEOK;JEON, KYO JUN;JEON, DU HAN;KIM, YOUNG MIN;JOO, YONG KYU;LEE, KWANG YOUNG |