| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor device and manufacturing method thereof. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate 10 having an electrode 14, a resin protrusion 20 formed on the semiconductor substrate 10, an inorganic insulating member 30 formed so as to cover the proximal end part 22 of the resin protrusion 20 and so as to expose the upper end part 24 of the resin protrusion 20, and a wiring 40 which is connected electrically with the electrode 14 and formed so as to reach the upper end part 24 of the resin protrusion 20 through on the inorganic insulating member 30. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
