| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by preventing a fault caused by moisture of a semiconductor element in a resin-molding semiconductor device. <P>SOLUTION: A resin-molding semiconductor device includes a block comprising a surface, backside and side face connecting the surface and the backside; a semiconductor element placed on a surface of the block; an external terminal connected to the block; and a molding resin for burying the block, the semiconductor element, and the external terminal so as to protrude one end of the external terminal. The external terminal is connected to the side face of the block. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
