发明名称 |
APPARATUS AND METHOD FOR MANUFACTURING PLATED FILM |
摘要 |
<p>A conductive surface 5 of a film 4 is plated with copper by allowing the film 4 to pass through a plating solution 7 in a plating bath 6 while conveying the film in a direction indicated by the arrow. Air knife devices 20A and 20B are disposed between the plating solution 7 and a next cathode roller 1B so as to face a conductive surface 5 of the film 4. The air knife devices 20A and 20B remove liquid and moisture on the conductive surface 5 by jetting heated air to the conductive surface 5 drawn out of the plating solution 7. Accordingly, even when the conductive surface 5 comes in contact with the next cathode roller 1B, developed silver is not dissolved, thereby preventing the silver contamination of the cathode rollers 1B and 1C.</p> |
申请公布号 |
WO2006137555(A1) |
申请公布日期 |
2006.12.28 |
申请号 |
WO2006JP312679 |
申请日期 |
2006.06.20 |
申请人 |
FUJI PHOTO FILM CO., LTD.;HYODO, TOMOYOSHI |
发明人 |
HYODO, TOMOYOSHI |
分类号 |
C25D7/06;C25D21/00;C23C18/14;C25D17/00 |
主分类号 |
C25D7/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|