| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive dry film excellent in work efficiency because of easiness of peeling of a support film from a photosensitive layer, ensuring a short curing time, excellent in heat resistance, and capable of efficient production of a printed wiring board. <P>SOLUTION: A photosensitive composition for a dry film contains (A) a photocurable carboxylic resin obtained by reacting a reaction product of a bisphenol type epoxy resin represented by formula (1) and an unsaturated group-containing monocarboxylic acid with a polybasic acid anhydride, (B) a photopolymerization initiator, (C) an epoxy resin selected from novolac type, triphenylmethane type, phenolaralkyl type and dicyclopentadiene type epoxy resins and, optionally, (D) a photocurable monomer or oligomer and (E) a curing reaction catalyst. The dry film using the composition is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
