发明名称 SEMICONDUCTOR-SUBSTRATE STORING APPARATUS, AND SEMICONDUCTOR-SUBSTRATE TRANSFER METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor-substrate storing apparatus and a semiconductor-substrate transfer method, whereby the reduction in the yield of semiconductor substrates can be suppressed due to dust. SOLUTION: The semiconductor-substrate storing apparatus has a semiconductor-substrate storing case 2 for storing therein a plurality of processed semiconductor substrates 1 so as to superimpose them on top of each other, substrate-holding means 3 for separating thereby from each other the plurality of processed semiconductor substrates 1 so as to hold them horizontally, and substrate protecting means 4 for making the means interpose, respectively in between the respective adjacent processed semiconductor substrates 1. Also, in the semiconductor-substrate transfer method, the plurality of processed semiconductor substrates 1 are superimposed at an equal space on each other, and the substrate-holding means 3 are interposed, respectively between the respective adjacent processed semiconductor substrates 1; and further, the processed semiconductor substrates 1 are stored horizontally in the semiconductor-substrate storing case 2 and transferred. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006351906(A) 申请公布日期 2006.12.28
申请号 JP20050177326 申请日期 2005.06.17
申请人 TOSHIBA CORP 发明人 MATSUNO TADASHI
分类号 H01L21/673;B65D85/86;H01L21/31 主分类号 H01L21/673
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