| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate capable of reducing the electric resistance of wiring and capable of achieving cost reduction and the formation of the wiring excellent in bonding strength to a base material, when manufacturing the wiring substrate using the base material having holes such as a through-hole, and to provide its manufacturing method. SOLUTION: The manufacturing method for the wiring substrate includes (A) a step for introducing an ion-exchange group to the surface of the base material 1 and the inner faces of the holes 2; (B) a step for introducing metal ions to the surface of the base material 1 and the inner faces of the holes 2 after treating the surface of the base material 1 and the inner face of the hole 2, to which the ion-exchange group is introduced, with a metal ion-containing liquid; (C) a step for introducing a photocatalyst to the surface of the base material 1 and the inner face of the hole 2 to which the metal ions are introduced; and (D) a step for forming metal layers 3, 5, and 6 composed of metals to the surface of the base material 1 and the inner faces of the holes 2, by emitting electromagnetic rays on the surface of the base material 1 and the inner face of the hole 2 to which the photocatalyst is introduced. At least the inner faces of the holes 2 are roughened in the step (A). COPYRIGHT: (C)2007,JPO&INPIT
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