| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating structure of a substrate which can effectively make it hard to have the heat, emitted from a metal core, given to predetermined electrical components from among a plurality of electrical components mounted on a metal core substrate. SOLUTION: The insulating portion 12 of the metal core substrate 10 has a heat-proof 14 which is penetrated through the metal core 11 in the thickness direction. From among the plurality of electric components 15, 16, 17, 18, and 19 which are mounted on the metal core substrate 10, the electric components 18 and 19 are located immediately above the heat-proof portion 14 for avoiding the heat emitted from the metal core 11. COPYRIGHT: (C)2007,JPO&INPIT
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