| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module capable of improving heat radiation effects, without using heat sinks and without increasing the electrode area. SOLUTION: The circuit module A is provided with a component 1, accompanied by heat generation during an operation, and a module substrate 2 for mounting the heat-generating component 1 on a surface. A surface electrode 3 thermally connected with the heat-generating component 1 is provided on the surface of the module substrate 2, a back surface electrode 5 facing the surface electrode is provided on the back surface, and a through-hole 6 is provided for heat radiation which connects the surface electrode 3 and the back-surface electrode 5. By integrally forming many recesses and projections 7 for increasing the surface area on the back surface electrode 5, heat radiating area is increased and heat radiation effect is enhanced. COPYRIGHT: (C)2007,JPO&INPIT |
