| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite electronic component, such that a plurality of substrates are arranged side by side and they are connected together by a single top plate, and its manufacturing method wherein the substrates can be easily and firmly connected compact, even if there are variations in the thickness among the substrates and electronic elements mounted on the surfaces of the substrates have different heights or the electronic elements are distributed unevenly. SOLUTION: The composite electronic component includes a first substrate 4a, whereon a plurality of first electronic elements 10a1-10c1 are arranged in the lateral direction, a second substrate 4b whereon a plurality of second electronic elements 10a2-10b2 are arranged in the lateral direction, and the top plate 20 which covers the heads of the plurality of electronic elements by the single body. At least a part of the surface of the top plate 20 is a flat plane, and there is a space formed between the rear face of the top plate 20 and the surfaces of the first and second substrates 4a and 4b. The heads of at least some of the electronic elements are embedded into the rear face of the top plate 20, and these electronic elements are integral parts of the rear face of the top plate 20. COPYRIGHT: (C)2007,JPO&INPIT |
