| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer electronic part capable of effectively reducing the fluctuation of inductance values before and after heating. SOLUTION: A stacked chip bead 1 which is one of such multilayer electronic parts is provided with a laminate 10 (armored section 11) formed by laminating insulators and a coil 30 disposed inside the laminate 10, and one cavity 40 circumscribed by the package 11 only or more are formed between coil conductors that form the coil 30. COPYRIGHT: (C)2007,JPO&INPIT
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