| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing system and a processing method for effectively removing particles that adhered to the inside of a carrier and those adhered to a wafer in the carrier. SOLUTION: The processing system comprises a processing section for processing a substrate W, and a mounting table 40 for mounting a storage vessel C for storing a plurality of substrates W. The storage vessel C can be mounted, in a state where the substrates W in the storage vessel C are aligned vertically being nearly horizontal, and in a state where an opening 20 for carrying the substrates W into and out of the storage vessel C is directed to the side of the storage vessel C. A plurality of gas ports 73 for supplying gas are provided outside the opening 20. Respective gas supply ports 73 are pointed in a direction of supplying gas nearly horizontally, toward the part between respective substrates W inside the storage vessel C. COPYRIGHT: (C)2007,JPO&INPIT
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