| 摘要 |
The present invention is intended to provide a highly reliable circuit pattern forming device which can cause a conductive solution to land on the substrate with high precision and which, when forming a multilayer printed circuit board, prevents closely arranged wires from becoming short-circuited. To realize this objective, this invention forms a circuit pattern by ejecting onto the substrate the droplets of insulating solution and the droplets of conductive solution while moving the liquid ejection unit and the substrate relative to each other. During this process, when both of the droplets are landed close together on the substrate, the droplets of insulating solution are made to land on the substrate prior to the droplets of conductive solution.
|
