发明名称 Method and apparatus for forming multi-layered circuit pattern
摘要 In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.
申请公布号 US2006292293(A1) 申请公布日期 2006.12.28
申请号 US20060447395 申请日期 2006.06.06
申请人 CANON KABUSHIKI KAISHA 发明人 TSURUOKA YUJI;MORI TAKASHI;YAMAGUCHI NOBUHITO;FURUKAWA MASAO;KAMIYA SEIICHI
分类号 C23C28/00 主分类号 C23C28/00
代理机构 代理人
主权项
地址