发明名称 Soft copper alloy, and soft copper wire or plate material
摘要 A soft copper alloy contains 10 mass ppm or less of oxygen, and more than 0.005 mass % and less than 0.6 mass % of indium. A soft copper alloy wire or plate material is manufactured by processing the soft copper alloy, wherein an average crystal grain size after annealing is 2 to 20 um.
申请公布号 US2006292029(A1) 申请公布日期 2006.12.28
申请号 US20050159417 申请日期 2005.06.23
申请人 HITACHI CABLE, LTD. 发明人 AOYAMA SEIGI;ENDO YUJU;HIRUTA HIROYOSHI
分类号 C22C9/00 主分类号 C22C9/00
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