Optical unit manufacturing method, e.g. for photo-sensor, involves removing segment of carrier layer from substrate and adhering segment to cover foil with adhesive force larger than force between carrier layer and substrate

摘要

The method involves applying a carrier layer on a substrate (2), a radiation-sensitive glue layer on the carrier layer and a radiation-permeable cover foil on the glue layer. A segment of the foil is irradiated with the segment of the glue layer. The segment of the carrier layer is removed from the substrate and is adhered to the foil with an adhesive force larger than the force between the carrier layer and the substrate.