| 摘要 |
An apparatus ( 1 ) for cooling electronic components comprises plate-shaped elements ( 2, 8 ), which enclose between them a cavity in the form of a flow channel, having connections ( 5, 6 ) for a liquid coolant flowing through the flow channel. One plate-shaped element comprises a highly thermally conductive, preferably metallic plate ( 8 ) connected in a thermally conductive manner to the electronic components. The flow channel can be matched, in terms of its arrangement and/or design, in particular as regards its flow length between the coolant connections ( 5, 6 ) and as regards its flow cross section, to provide selective location of higher cooling capacity for points having a high degree of heat development from the electronic components
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