| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive having a silica skeleton having good conductivity and adhesive strength even under high temperatures. SOLUTION: A thermosetting conductive adhesive comprises a porous silica material precursor solution containing a hydrophobic organic compound having silicon atoms, a cationic surfactant, and a metal-containing additive. The adhesive is capable of conductive bonding by forming a conductive path after heat-curing based on metal elements aggregated in micelles in the conductive adhesive. The adhesive keeps the adhesive strength, for example, even at a high temperature of 300°C. COPYRIGHT: (C)2007,JPO&INPIT
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