Semiconductor device used in electronic apparatus, has adhesion promoter layer with microporous morphology between semiconductor device components and plastic compositions, and having nanoscale ceramic grains applied by wet chemical process

摘要

The device (1) has semiconductor device components (3) embedded in a plastic composition (2). A surface of one or more of the semiconductor device components has an adhesion promoter layer (5) with microporous morphology partially between the semiconductor device components and plastic composition. The adhesion promoter layer has an average thickness of between 5 and 300 nanometers, and has nanoscale ceramic grains applied by wet chemical process. Independent claims are included for the following: (1) System carrier; (2) System carrier fabrication method; and (3) Semiconductor device manufacture.