SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND REGULATOR USING THE SAME

摘要

A semiconductor integrated circuit device (IC1) comprises a semiconductor chip (CHIP1), a first frame lead (FR1), and a second frame lead (FR2). The semiconductor chip (CHIP1) includes common-base transistors (P1, P2), pads (T11, T12) connected to the respective emitters of the common-base transistors (P1, P2), pads (T21, T22) connected to the respective collectors of the common-base transistors (P1, P2), and a means (DRV, ERR, E1) for generating a base signal. The pads (T11, T12) are connected through the respective bonding wires (W11, W12) to the first frame lead (FR1). The pads (T21, T22) are connected through the respective bonding wires (W21, W22) to the second frame lead (FR2). This structure can easily detect breaking of the bonding wires connected in parallel.