| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor cooling apparatus which is easy to work upon a flow path of a coolant into a desired shape with high thermal efficiency. SOLUTION: The semiconductor cooling apparatus 100 is constituted of a plastic-made coolant flow path plate 10 having flow paths 11 and 12 of the coolant bored on the upper surface, a metallic cooling plate 20 stuck to the upper surface of the coolant flow path plate to seal the upper surface of the flow paths on the flow path plate, a coolant inlet pipe 31 and a coolant outlet pipe 32. Since the coolant flow path plate 10 is made of plastic, it is easy to bore the flow paths 11 and 12 for the coolant on its upper surface and easy to define a complicated shape of the flow path when needed. Thus, the cooling plate can be efficiently cooled. In addition, the apparatus can be inexpensively manufactured, as the shape of the flow path can be easily defined. COPYRIGHT: (C)2007,JPO&INPIT
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