发明名称 |
Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package |
摘要 |
An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
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申请公布号 |
US2006290457(A1) |
申请公布日期 |
2006.12.28 |
申请号 |
US20060400637 |
申请日期 |
2006.04.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE MOON-CHUL;KWON JONG-OH;KIM WOON-BAE;SHIN JEA-SHIK;HWANG JUN-SIK;LEE EUN-SUNG |
分类号 |
H01F5/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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