| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for a solder resist ink, which yields a cured coating film which shows good resolubility in dilute aqueous alkaline solution and is excellent in durability under high-temperature, high-humidity conditions. <P>SOLUTION: The resin composition for solder resist ink contains an acid pendant epoxy acrylate resin and a photopolymerization initiator. The acid pendant epoxy acrylate resin is obtained by reacting a polycarboxylic anhydride with an epoxy acrylate resin obtained by reacting an acrylic acid mixture with a polyfunctional epoxy resin (c), wherein the acrylic acid mixture contains an acrylic acid (a) and a methacrylic acid (b) in a molar ratio (a/b) of from 3/97 to 45/55. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
