| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has superior heat dissipation without any restriction on the design flexibility while being made compact. <P>SOLUTION: The semiconductor device 1 has a recess 5 on the side of a first surface facing a mounting substrate to be mounted, and also has a semiconductor element 6 mounted on the bottom surface of the recess 5. Further, the device has a continuous conductor layer 15 extending from a wiring layer 4c' on the bottom surface of the recess 5 to a wiring layer 4d' on the first surface via a wiring layer 4e on the flank of the recess 5, and the semiconductor element 6 is mounted on the conductor layer 15. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
