发明名称 Resin compositions with high thermoplatic loading
摘要 Uncured thermosetting resins are loaded with relatively high amounts of solid thermoplastic resin particles to form a resin precursor. The resin precursor is heat treated so as to produce an uncured resin composition wherein the thermoplastic resin particles become substantially dissolved in the thermosetting resin without causing cure of the resin mixture. Heat treatment of highly loaded thermosetting resins in accordance with the present invention provides uncured resin compositions that are well suited for use in fabricating composite structures and particularly prepreg for use in lightning protection surface coatings.
申请公布号 US2006292375(A1) 申请公布日期 2006.12.28
申请号 US20050168971 申请日期 2005.06.28
申请人 MARTIN CARY J 发明人 MARTIN CARY J.
分类号 B32B27/38;B32B27/04;B32B37/00;C08L63/00 主分类号 B32B27/38
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