发明名称 PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC PARTS AND METHODS OF FABRICATION THEREFOR
摘要 A printed circuit board with an embedded electronic component and a fabrication method thereof are provided to obtain high electrical reliability by connecting the electronic component by direct coupling between a bonding layer and an electrode of the electronic component. In a printed circuit board(30) with an embedded electronic component comprising an external electrode, a base film(31) is composed of an insertion hole(33) accommodating the electronic component. A filler(35) is filled between the electronic component and the insertion hole, and fixes the electronic component. A bonding layer(37) is bonded with the electrode, by being stacked on the base film. A circuit is formed on the bonding layer.
申请公布号 KR20060134393(A) 申请公布日期 2006.12.28
申请号 KR20050054035 申请日期 2005.06.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, SUK HYEON;RYU, CHANG SUP;CHO, HAN SEO;BAEK, SANG JIN;AHN, JIN YONG
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
代理机构 代理人
主权项
地址