PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC PARTS AND METHODS OF FABRICATION THEREFOR
摘要
A printed circuit board with an embedded electronic component and a fabrication method thereof are provided to obtain high electrical reliability by connecting the electronic component by direct coupling between a bonding layer and an electrode of the electronic component. In a printed circuit board(30) with an embedded electronic component comprising an external electrode, a base film(31) is composed of an insertion hole(33) accommodating the electronic component. A filler(35) is filled between the electronic component and the insertion hole, and fixes the electronic component. A bonding layer(37) is bonded with the electrode, by being stacked on the base film. A circuit is formed on the bonding layer.
申请公布号
KR20060134393(A)
申请公布日期
2006.12.28
申请号
KR20050054035
申请日期
2005.06.22
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
CHO, SUK HYEON;RYU, CHANG SUP;CHO, HAN SEO;BAEK, SANG JIN;AHN, JIN YONG