发明名称 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition having good solubility in a resist solvent and capable of suppressing variation in pattern size when exposure energy varies, and to provide a method of forming a resist pattern. <P>SOLUTION: The positive resist composition contains (A) a resin component and (B) an acid generator component, wherein the resin component (A) is a copolymer having a mono(&alpha;-lower alkyl) acrylate-based constitutional unit (a0) containing a carboxy group and/or a hydroxyl group, a mono(&alpha;-lower alkyl) acrylate-based constitutional unit (a1) containing an acid-dissociable dissolution inhibiting group, a mono(&alpha;-lower alkyl) acrylate-based constitutional unit (b1) having a lactone ring, and a constitutional unit (c1) derived from formula (1), wherein R is a lower alkyl group or H; R<SP>11</SP>and R<SP>12</SP>are each independently a lower alkyl group; (n) is an integer of 1-5; and A is a bi- to hexavalent organic group. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006349940(A) 申请公布日期 2006.12.28
申请号 JP20050175330 申请日期 2005.06.15
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKESHITA MASARU;UCHIUMI YOSHIYUKI;HAYASHI RYOTARO;HANEDA HIDEO
分类号 G03F7/039;C08F220/10;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址