发明名称 PATTERN FORMING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate which is suitable for forming a pattern by an ink jet system without neither allowing a fluid body before drying to be widely spread in forming the pattern nor dividing the pattern after drying. SOLUTION: A pattern forming substrate is manufactured by a method including: a process for applying a silane coupling agent on the pattern forming surface of a base (100) so as to form a silane coupling film (101); a process for arranging masks (102) which meets the pattern on the silane coupling film (101); and an activating process for giving energy to the silane coupling film (101) from above the masks (102), activating the film, and generating a polar radical. The polar radical such as a hydroxyl group, a carboxyl group, an amino group or an amino carbonyl group is generated in areas where the masks (102) are not arranged on the silane coupling film (101), so as to show hydrophilic property. Hydrophobic property is obtained in areas where the masks (102) are arranged. The substrate has a function as a universal substrate which is suitable for forming the pattern by the ink jet system. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006352156(A) 申请公布日期 2006.12.28
申请号 JP20060222236 申请日期 2006.08.17
申请人 SEIKO EPSON CORP 发明人 KANBE SADAO;FUKUSHIMA HITOSHI;KIGUCHI HIROSHI;SEKI SHUNICHI
分类号 H01L21/027 主分类号 H01L21/027
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