| 摘要 |
PROBLEM TO BE SOLVED: To realize that patterns can be inspected with high accuracy, eliminating the effects due to patterns other than the patterns belonging to a layer as an object of inspection, when the patterns, belonging to two or more layers, are contained in the images of a semiconductor device photographed by an electron microscope etc. SOLUTION: The pattern inspection unit can be mounted on, for instance, a scanning electron microscope system, and is capable of separating the patterns into patterns of each layer using CAD data on the layers, corresponding to the patterns when the patterns of two or more layers are contained in SEM images. According to this setup, the inspections of only the patterns of layers can be realized as an object of inspection and the patterns that differ from each other for each layer, and the detection of positional shifts can be realized between the layers. COPYRIGHT: (C)2007,JPO&INPIT
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