| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrooptical apparatus, a manufacturing method for the same and an electronic equipment, in which wiring pattern cut in a bending section of a flexible circuit substrate is prevented. SOLUTION: In the electrooptical apparatus including a substrate for the electrooptical apparatus to which the flexible circuit substrate provided with a wiring pattern is connected and an electrooptical material which is held by the substrate for the electrooptical apparatus, the flexible circuit substrate has the bending section, and for example, a buffer material of a plate or cylindrical shape is arranged between the flexible substrates, each of which is placed linking from the bending section, or inside the bending section. COPYRIGHT: (C)2007,JPO&INPIT
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