摘要 |
Submount (3) mounted on circuit board (4), has conductive patterns (3a) formed on surface layer of multilayer board and connected to electrodes of LED chip (2). The conductive patterns (3b) are formed on intermediate layer of the multilayer board and connected to conductive patterns (4a) of the circuit board through conductive wire (5), such that power is fed from circuit board to the LED chip through conductive patterns (3a,3b). An independent claim is included for: the light source apparatus. |