发明名称 SURFACE-MOUNTED ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a surface-mounted electronic part capable of suppressing the generation of a defect in mounting. SOLUTION: A chip inductor L1 which is one of such surface-mounted electronic parts is provided with a rectangular layered product 1, and external electrodes 3, 5 formed on the layered product 1. A pair of the external electrodes 3, 5 individually have first electrodes 3a, 5a formed on each one of a pair of first sides 20a, 20b opposed the each other on the layered product 1, and second electrodes 3c, 5c and second electrodes 3b, 5b which are individually adjacent to a pair of the first sides 20a, 20b and formed on one of a pair of second side 20e and fourth side 20f that are opposed the each other. The thickness R of a corners connecting the electrodes are 70% or more of those H of the second electrodes 3c, 5c and the second electrodes 3b, 5b. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006352017(A) 申请公布日期 2006.12.28
申请号 JP20050179432 申请日期 2005.06.20
申请人 TDK CORP 发明人 TOZAWA YOJI;NAKAGAWA SEIICHI;SUKAI MASANORI;KURIMOTO SATORU;CHIBA KAZUNORI;KUMAGAI OSAMI
分类号 H01F27/29;H01C1/142;H01G4/12;H01G4/30 主分类号 H01F27/29
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