| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover lay film which has superior adhesion with an interlayer adhesive layer, and a composite board using the film. SOLUTION: The cover lay film has an insulating film, an adhesive layer made of an adhesive composition for a semiconductor device and a peelable protective film, and the average surface roughness (Ra) of a surface without the adhesive layer in the insulating film is 0.05μm or more. COPYRIGHT: (C)2007,JPO&INPIT
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