SEMICONDUCTOR DEFECT ANALYZING DEVICE, DEFECT ANALYZING METHOD, AND DEFECT ANALYZING PROGRAM

摘要

A defect analysis device (10) is constituted to include an inspection information acquisition unit (11) for acquiring a defect observation image (P2) of a semiconductor device, a layout information acquisition unit (12) for acquiring layout information, a defect analysis unit (13) for making an analysis on the defect of the semiconductor device, and an analysis image display control unit (14) for displaying the information on the analysis result in a display device (40). The defect analysis unit (13) sets an analysis area with reference to the defect observation image (P2), and extracts a net to pass through the analysis area, form a plurality of nets contained in the layout of the semiconductor device. Thus, it is possible to realize a semiconductor defect analyzing device, an analyzing method, and an analyzing program, which can perform the analysis of the defect of the semiconductor device reliably and efficiently.