SEMICONDUCTOR COMPOSITE DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor composite device and a method for manufacturing the same are provided to improve a sealing package by not exposing a MEMS(Micro Electro Mechanical System) by inserting a space layer into a protection layer. In a semiconductor composite device, a semiconductor device(21) is formed on a substrate(11). An insulating layer(41) is formed on the substrate for coating the semiconductor device(21). A micro electro mechanical system (31) is formed on the insulating layer. And, a wiring layer(50) is connected to the semiconductor device and the MEMS.