| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition cured by radiation, excellent in scratch resistance and abrasion resistance and having low refractive index and having low reflectance when used for antireflective films and further to provide a film having its cured film. SOLUTION: The photosensitive resin composition comprises (A) a silicon compound obtained by condensing an alkoxysilicon compound having an epoxy group and represented by general formula (1): R<SB>e</SB>Si(OR<SB>1</SB>)<SB>3</SB>(wherein R<SB>e</SB>is a substituent having an epoxy group; R<SB>1</SB>is a 1-4C alkyl group) in the presence of a basic catalyst, (B) a colloidal silica with a nano porous structure having 1-200 nano meter primary particle diameter, (C) a polymer compound in which the stem part is composed of a hydrocarbon-based polymer and the branch part is composed of a silicone and (D) a cationic photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT
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