WIRE BONDING MACHINE CAPABLE OF REMOVING PARTICLES FROM CAPILLARY AND CLEANING METHOD OF CAPILLARY BOTTOM TIP

摘要

A wire bonding machine capable of removing particles from a capillary is provided to automatically remove various kinds of particles formed on the lower end tip of the capillary by periodically transferring the capillary to a polishing film and by transferring the lower end tip of the capillary by a predetermined distance while the lower end tip is rubbed against the polishing film. A capillary(10) having a lower end tip is mounted on a bonding arm. The bonding arm delivers ultrasonic wave energy to the capillary, capable of transferring in X-axis, Y-axis and Z-axis directions by a predetermined distance. A polishing film(70) is installed under the capillary. The lower end tip of the capillary is rubbed and transferred along a predetermined path by the transfer of the bonding arm so that various kinds of particles formed at the lower end tip of the capillary are eliminated. The polishing film is composed of a film with a predetermined thickness and polishing particles attached to the upper part of the film by using adhesive. The transfer path of the lower end tip of the capillary is a straight lien type with a predetermined length.