| 摘要 |
A robot blade used to fabricate a semiconductor device is provided to increase a coefficient of friction of a wafer by forming a slip-resistant unit in a rectangular seal shape, thereby minimizing sliding of a wafer. A robot blade includes a seat part on which a wafer(W) is seated, and at least one slip-resistant unit(120) preventing the wafer from slipping on an upper surface of the seat part. The slip-resistant unit consists of a rectangular seal to increase a frictional area of the wafer. The slip-resistant unit is a rubber O-ring. Three slip-resistant units are spaced apart from each other on an upper surface of the robot blade at regular intervals.
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