REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
摘要
<p>Disclosed is a highly reliable material for flexible printed wiring boards which enables fine wiring. Specifically disclosed are a compound represented by the general formula (I) below, and a resin composition containing such a compound as a reactive monomer. (I) (In the formula, one of X and Y represents =O and the other represents =NAr<SUP>2</SUP>R<SUP>2</SUP>; and R<SUP>1</SUP>, R<SUP>2</SUP>, Ar<SUP>1</SUP> and Ar<SUP>2</SUP> are as defined in the description.)</p>
申请公布号
WO2006137369(A1)
申请公布日期
2006.12.28
申请号
WO2006JP312270
申请日期
2006.06.20
申请人
AMT LABORATORY CO., LTD.;MANAC INC.;WATANABE, HISASHI;NAKAJIMA, KENJI;TANAKA, KEIZO;NANBA, SATORU
