| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit wherein the influence of noises generated when operating its semiconductor element is reduced largely, and it is excellent in its heat radiating characteristic and its cost. <P>SOLUTION: In a multilayer circuit board having metal bases, there are formed a conductive layer (a) (not shown) provided on a metal plate (1) (not shown) via an insulation layer (A) (not shown), a conductive layer (b) (not shown) provided on the conductive layer (a) (not shown) via a solder layer, and further, a metal plate (2) (not shown) mounted thereon via an insulation layer (B) (not shown). In the hybrid integrated circuit, by using the multilayer circuit board having the metal bases, a semiconductor element is provided on the opposite surface of the metal plate (1) (not shown) to the conductive layer (a) (not shown) or is provided on the opposite surface of the metal plate (2) (not shown) to the conductive layer (b) (not shown). Further, the semiconductor element and the metal plate (1) (not shown) or the semiconductor element and the metal plate (2) (not shown) are connected electrically with the conductive layers (a), (b) (not shown) by aluminum or gold wires. <P>COPYRIGHT: (C)2004,JPO</p> |
