| 摘要 |
A stack type package is provided to reduce the thickness of the package itself by connecting electrically packages with each other using a protruded foil structure. An upper foil(120) is protruded to both sides of an upper package. A lower foil(220) is protruded to both sides of a lower package. The lower package is attached to one surface of the upper package. A solder paste(300) is used for fixing the upper and the lower foil to each other. A plurality of solder ball(400) are mounted on the other surface of the upper package. The upper and the lower foil are made of copper. A heat sink is further installed at a predetermined surface of the lower package.
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