A method for forming an oxide layer is provided to manufacture the oxide layer excluding a native oxide layer by forming the oxide layer after removing the native oxide layer formed on a substrate by using process gas. A substrate is loaded to a reactor having first temperature(T1)(I-1). As the first temperature of the reactor is ramped up to second temperature(T2), a first process gas including silicon is provided to pre-process the substrate(I-2). The silicon controls a native oxide layer formed on the substrate. The native oxide layer formed on the substrate is removed at atmospheric pressure that a second process gas is provided. The second process gas includes the second temperature and the silicon(I-3). A surface of the substrate is oxidized to form an oxide layer(I-3).
申请公布号
KR20060133675(A)
申请公布日期
2006.12.27
申请号
KR20050053428
申请日期
2005.06.21
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, JUNG HWAN;KIM, BONG HYUN;LEE, JAI DONG;SHIN, HYUN JIN