| 摘要 |
<p>Provided is an exposure head (1,5), including: an array substrate (8) having a plurality of organic EL elements (33,34) arranged in an array on one face; and a plurality of circuit chips (7) having a circuit for driving the organic EL element (33,34), and in which the forming face of the circuit is serially arranged along the extending direction of the array substrate (8) so as to face one face of the array substrate (8); wherein the plurality of circuit chips (7) are mutually serially connected by providing a pair of wiring groups (32,35,36,38,41,59) for each mutual boundary location of the circuit chips (7) on one face of the array substrate (8) and outside the arrangement area of the organic EL element (33,34), bump-bonding (37,39,42) one of the adjacent circuit chips (7) to one end of the pair of wiring groups (32,35,36,38,41,59), and bump-bonding (37,39,42) the other adjacent circuit chip (7) to the other end of the pair of wiring groups (32,35,36,38,41,59).
</p> |
