发明名称 |
RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME |
摘要 |
<p>A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.</p> |
申请公布号 |
EP1736520(A1) |
申请公布日期 |
2006.12.27 |
申请号 |
EP20050720935 |
申请日期 |
2005.03.16 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
OKUBO, HIKARU;TANAKA, NOBUKI;WATANABE, ITARU . |
分类号 |
C09J201/02;C08F290/06;C08G69/40;C08G69/46;C08G73/12;C08L79/08;H01L21/52;H01L21/58;H01L23/373 |
主分类号 |
C09J201/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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