摘要 |
A polishing pad for chemical mechanical polishing, which has an excellent removal rate and is capable of polishing for providing excellent planarity. This polishing pad comprises 70 to 99.9 mass % of (A) a crosslinked diene elastomer and 0.1 to 30 mass % of (B) a polymer having an acid anhydride structure based on 100 mass % of the total of the above components (A) and (B) and has a specific gravity of 0.9 to 1.2. |