Flip-chip semiconductor device having I/O modules in an internal circuit area

摘要

A semiconductor device includes an internal circuit area (11) including a plurality of I/O modules (51 to 58), and a peripheral area (12) receiving therein a pair of loop test lines (21, 22) for testing I/O buffers (30) in the I/O modules (51 to 58). The internal test line (23, 24) extending from each of the loop test lines (21, 22) toward the internal circuit area (11) includes an out-module test line (23, 24) formed as the topmost layer, a first in-module test line (23, 24) formed as the topmost layer and connected to the out-module test line (23, 24), and a second in-module test line (25, 26, 27, 28), a portion (25, 26) of which is formed by connecting the in-buffer test lines together.