| 摘要 |
<p>In a semiconductor device disposed with terminals for external connection, input terminals 11, power supply terminals 12 and ground terminals 13 are disposed close together on part of one edge portion 10b of two opposing edge portions. Output terminals 14x are disposed in the vicinity of both ends of the one edge portion 10a and on another edge portion 10b of the two edge portions. A ground wiring 17 is routed from the other edge portion 10b and connected to the ground terminals 13. In so doing, elemental devices connected to the input terminals 11 are disposed close together, whereby needless gaps do not arise between the elemental devices. A ground potential is also supplied by the ground wiring.</p> |
